EB-119M
EB-119M
EB-119M is a low viscosity, unfilled epoxy adhesive and encapsulating compound. EB-119M can fill very small gap sizes through capillary flow. The capillary action of EB-119M allows fills small gaps in flip chip designs. EB-119M can cure in under 1 minute at 175°C. EB-119M can also be used a fill epoxy in dam-and-fill applications. In the optoelectronics industry, EB-119M is used in bundling optical fibers. Underfills such as EB-119M are used when the gap size for underfills is below 15-20 microns which filled systems may not be able to flow into due to the particle size.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/5 |
| Mixed Viscosity @RT(cps) | 800-1200 |
| Pot Life @25°C(100 gram) | >8 hrs |
| Recommended Cure | 15-20 min @ 125°C |
| Alternate Cure | 5 min @ 150°C |
| Color | Amber |
| Specific Gravity | 1.18 |
| Hardness(Shore) | D-91 |
| Refractive Index | 1.52 |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 158 |
| CTE(Below Tg)10-6/°C | 38 |
| Service Temp.Range | -55°C to 230°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | >1014 |
Recommended Applications
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