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potting and encapsulatingRecent-news

Polyurethane Potting Compounds

Polyurethane potting compounds are a type of thermosetting polymer material commonly used in electronics and electrical applications for encapsulating or potting electronic components. Potting refers to the process of enclosing or embedding components in a protective compound to enhance their durability, protect against environmental factors, and provide electrical insulation. Polyurethane potting compounds are formulated by combining two main components: a polyol resin and an isocyanate hardener. These components react chemically…
Paven Patel
July 7, 2023
Recent-newsEpoxy AdhesiveUV/LED

FLASHBOND UV-3607HT NOMINATED FOR PRODUCT OF THE YEAR

Epoxyset is proud to announce the nomination of its new UV/Heat cure epoxy, FLASHBOND UV-3607HT for Product of the Year at the Assembly Show 2021 in Rosemont, IL. This is second year (2019) Epoxyset has been nominated for this award. You can read the details from Assembly Show website here. Visit us at Booth 1811 at the Donald E. Stephens Convention Center in Rosemont, IL on Oct. 25-28 to learn…
Paven Patel
October 14, 2021
Recent-news

Epoxyset Custom Formulations Solve Demanding Application and Processing Needs

Epoxyset offers a wide range of engineered adhesives and potting compounds. We have worked tirelessly to put forward a standard product line that is varied in physical and cured properties. Since 1997, Epoxyset has provided the electronics, micro-electronics, medical, automotive, medical, and optical industries since 1997 and continues to do so with an ever expanding product line. Sometimes, however, an application arises that calls for a customized or modified product…
rob_bdc
June 21, 2014
Recent-news

Laboratory Instruments and Capacity

Our laboratory is equipped with an assortment of analytical instruments to provide essential data of the final product.  Below is a list of some of our most essential lab instruments and test methods. Test Method Data Supplied Viscometer Rheology/Viscosity Differential Scanning Calorimetry (DSC) Glass Transition Temperature (Tg) & Cure Kinetics Lap Shear (Tensile Tester) Bond Strength Thermogravimetric Analysis (TGA) %Weight Loss Fourier Transform Infrared Spectroscopy (FTIR) Chemical Composition Laser Flash…
rob_bdc
June 21, 2014
Recent-news

EB-403-1-ALAN

EB-403-1-ALAN is a one component, highly filled, thermally conducive epoxy. Stable for up to 4 months at room temperature...
rob_bdc
April 5, 2014
Recent-news

EB-106

EPOXIBOND EB-106 is a low viscosity, optically clear, epoxy adhesive. With a pot life of 1 hour, this product is ideal for bonding ...
rob_bdc
April 5, 2014