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Description

Semiconductor & Electronic Assembly Adhesives

Epoxyset manufactures a wide range of products designed specifically for use electronic assembly. We supply materials for use in dam & fill, glob top, die attach, underfills etc. Our products are tested and proven to work for numerous applications and range in properties such as viscosity, conductivity, and cure times to fulfill a wide range of specifications. Below are some of our featured products but not our entire product line. Contact Epoxyset for more options and details.

Item #ColorSpecific GravityService TemperatureThermal ConductivityVolume ResistivityData Sheet
Silver3.6-55°C to 200°C2.00.0004 download
Silver3.50-55°C to 250°C1.8<0.0003 download
Silver3.90-55°C to 200°C4.2<0.0003 download
Silver3.90-55°C to 200°C2.0<0.0004 download
Grey2.1-55°C to 230°C2.4>1x1015 download
Amber1.18-55°C to 230°CNA>1014 download
Black1.56-55°C to 220°C0.46x1015 download
Black1.6-55°C to 150°C0.5>1015 download
Black2.10-55°C to 230°C1.46x1015 download
Black1.82-55°C to 200°C0.8>1015 download
Black1.82-55°C to 200°C0.8>1015 download
Black1.82-55°C to 200°C0.42 x 10^15 download
Black1.82-55°C to 200°C0.42 x 10^15 download
Black1.5-55°C to 175°C0.45>1015 download
Black1.76-55°C to 200°C0.32 x 10^15 download
Beige/Amber1.8-55°C to 200°C0.32 x 10^15 download
Black1.5-55°C to 220°C0.45>1015 download
Black2.10-55°C to 250°C1.86x1015 download
Grey1.9-55°C to 250°C1.06x1015 download
White/Amber1.45-55°C to 200°C1.06x1015 download
Grey2.1-55°C to 230°C2.4>1x1015 download
Clear Amber1.2-55°C to 250°CNA>1015 download