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EB-403-1-ALAN

High thermal conductivity epoxy

Description

product image EB-403-1-ALAN epoxy by EpoxySet

Thermal conductivity of adhesive systems depends on a number of factors including type and amount of filler, size of fillers, air etc. Many thermally conductive adhesive use one type of filler and one size of filler which adds conductivity but only a little. EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 W/mK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding. EB-403-1-ALAN

Specifications

No.of Components 1
Mix Ratio by WeightNA
Mixed Viscosity @RT(cps)>800,000
Pot Life @25°C(100 gram)3 months
Recommended Cure1 hr @ 100°C + 1 hr @ 150°C
Alternate Cure30min @ 150°C
ColorGrey
Specific Gravity2.1
Hardness(Shore)D-90
Refractive IndexNA
Lap Shear Strength @25°C(psi)2620
Tg(°C)132
CTE(Below Tg)10-6/°C38
Service Temp.Range-55°C to 230°C
Thermal Conductivity(W/m°K)2.4
Volume Resistivity(500 V)1.0 x 10^13