EC-1015LV-RT
THERMALLY CONDUCTIVE POTTING
EC-1015LV-RT
EC-1015LV-RT is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life. It is useful for potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:10 |
| Mixed Viscosity @RT(cps) | 2,000-3,000 |
| Pot Life @25°C(100 gram) | 40-60 min |
| Recommended Cure | 24 hours @ 25°C |
| Alternate Cure | 2 hours @ 70°C |
| Color | Black |
| Specific Gravity | 2.1 |
| Hardness(Shore) | D-92 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 67 |
| CTE(Below Tg)10-6/°C | 34 |
| Service Temp.Range | -55°C - 130°C |
| Thermal Conductivity(W/m°K) | 1.4 |
| Volume Resistivity(500 V) | 1 x 10^15 |
Recommended Applications
Potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
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