Tag Archives: adhesive epoxy potting compound

Featured Products

EC-1006M-4

EC-1006M-4

March 27th, 2014

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EPOXICAST EC-1006M-4 is a thermally conductive potting compound designed for use in electronic components. It is a halogen free, flame retardant potting compound certified by Underwriters Laboratory for 94-V0 requirements. A low viscosity material, it is ideal for potting electronic components where a need to fill small voids is important and low electrical leakage is required. EC-1006M-4 can cure within 24 hours at room temperature or can be accelerated by using heat.