OEMs face ever-growing requirements for greater chip functionality, reduced size, mechanical toughness, and high reliability. As market trends that drive greater functionality, reliability, and ruggedness, the consumer demand for handheld, mobile, and portable systems, such as smart phones and tablets increase daily. Ball Grid Array (BGA) and chip scale packaging (CSP) are common solutions for many of these problems however; other problems arise in using these techniques. Common processing problems…
rob_bdcDecember 16, 2014
