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EPOXYSET ADHESIVE SOLUTIONS FOR BONDING DISSIMILAR SUBSTRATES

Bonding Substrates with Different Thermal Expansion Coefficients A major challenge many engineers and/or designers face in a bonding or potting application is overcoming different coefficients of thermal expansion (CTE). What is the coefficient of thermal expansion? The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. Specifically, it measures the fractional change in size per degree change in temperature at a constant…
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September 19, 2014