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EPOXYSET ADHESIVE SOLUTIONS FOR BONDING DISSIMILAR SUBSTRATES

Bonding Substrates with Different Thermal Expansion Coefficients A major challenge many engineers and/or designers face in a bonding or potting application is overcoming different coefficients of thermal expansion (CTE). What is the coefficient of thermal expansion? The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. Specifically, it measures the fractional change in size per degree change in temperature at a constant…
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September 19, 2014
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EB-403-1-ALAN

EB-403-1-ALAN is a one component, highly filled, thermally conducive epoxy. Stable for up to 4 months at room temperature...
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April 5, 2014
Recent-news

EB-106

EPOXIBOND EB-106 is a low viscosity, optically clear, epoxy adhesive. With a pot life of 1 hour, this product is ideal for bonding ...
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April 5, 2014
Featured Products

EB-316M

EPOXIBOND EB-316M is a semi-rigid, two-part epoxy adhesive with a 1:1 mix ratio, 90 minute work life and handling strength in 10 hours. EB-316M cures at room temperature and provides high strength bonds with exceptional performance in shear and peel. It can be used to bond rubber, metal, wood, most plastics and masonry products and has good environmental resistance.
rob_bdc
March 27, 2014
Featured Products

EC-1006M-4

EPOXICAST EC-1006M-4 is a thermally conductive potting compound designed for use in electronic components. It is a halogen free, flame retardant potting compound certified by Underwriters Laboratory for 94-V0 requirements.
rob_bdc
March 27, 2014